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   Above 23 years of experience in chip architecture/digital/analog design/system development/chip technology innovation, is the leader of R&A chip technology, the creator of HS chip, and the chairman of CIDM chip design-alliance. He has led two chip design companies to successful IPOs.

In 2010, he built the audio/video master SoC/IoT chip team from scratch, and within 2 years, he completed the establishment of SoC-level chip/algorithm/software/system development team, and successfully completed the development of the world's first 4K/8K ultra HD video processing chip in 4 years. 3 series and 17 models of chips (electronic + automotive) were successfully mass-produced and marketed within 10 years. Winner of "Outstanding Youth" in 2016, National Science and Technology Innovation Talent Award in 2017, National Science and Technology Invention Award in 2018, CEO Excellence Award in 2019 and 2022. 9 municipal/provincial/national technical awards, 46 technical invention patents and software copyrights, US PMP, member of China Communications Society. Technical member of China Communications Society.

   In the past 10 years, he has completed the chip definition/architecture/development of H&S3000[2013]/H&S3200[2014]/H&S3700[2015]/H&S3710[2017]/H&S3620/H&S3720[2018]/H&S2800/2810/2900[2018&2019] and chip mass production and mass market. H&S37X0 Ultra HD field market share >42.4%, Smart TV, automotive electronics, AIoT three major fields are successfully mass production, average 1.6KK/month shipment. 3 series/8 categories/17 derivative chip models, are the leading planning/development/market/innovation, TV SoC/TV FRC/TV TCON/IoT Cumulative shipment of BT&WiFi/MCU/IGBT >120 million units.

   2 successful IPOs and hands-on control of chip technology companies, 5 IPOs or lead acquisitions of companies with 0->1 origination, development and evolution of >10 billion products (2 in Shanghai, 1 in Qingdao, 1 in Japan, 1 in US). Chief architect of mega SoC chips, top practical expert in chip architecture, system design, and algorithm software.

   The founder of SMIC and  the recipient of the International Science and Technology Award (national level) and the Outstanding Entrepreneurship Award (national level) from the People's Republic of China. Richard Chang, graduated from National Taiwan University, received his M.S. degree in engineering from the State University of New York at Buffalo, and his Ph.D. degree in electrical engineering from Southern Methodist University. He has extensive experience in semiconductor chip R&D, advanced process and chip manufacturing, and has successfully created and managed >10 FABs in the US, Japan, Singapore, Italy and Taiwan. Worked at Texas Instruments for 20 years, during which he joined the team of Jack Kilby, one of the inventors of the integrated circuit and Nobel Prize winner in physics. He has served as President of WSMC, President of Rayson Technology, and President of Sunrise Semiconductor. Richard has always been concerned about and supported China's scientific and technological progress, and promoted the development of China's information industry, so that China's large-scale integrated circuit manufacturing technology has improved "several generations", greatly reducing the gap with the world's advanced level. Many Chinese semiconductor companies CEO, CTO, COO and other executives, are from Richard team, known as the father of China's semiconductor  industry.

   Chief Technology Officer (Advisor) of YiMoon Technology, strategic innovation of AI SoC chips and automotive electronic chips, chip process, process customization, focusing on the field of automotive

   More than 22 years of experience in chip architecture/digital/analog design/system development/chip technology innovation, and is the technology leader of R&A and FTDI chips. Long term direct R&D coding experience in top global semiconductor and chip design teams. Strong combat capability, the technical team led by him is tough, dare to fight and win battles.

   He has been a senior engineer, digital R&D director and department director in a world-renowned RF chip company, engaged in LPA\WDPA\DPA series communication chip development, optimal control and digital pre-distortion control algorithm. Jieheng Electronics, fully responsible for the technical team formation and audio processing chip development, successfully mass production of two sets of pitch and tone processing characteristics of the chip, and achieve mass production of the whole product. Set up FTDI China R&D department and led the team to successfully mass produce the company's second main product line FT8XX series EVE (Embedded Video Engine) chips and FT9XX series 32bit MCU chips, which are widely used in consumer, industrial, medical and automotive applications.

   As a co-founder of YiMoon , he is the director and CTO of YiMoon, and is responsible for the development of YiMoon AIoT and YiMoon J3 H1/L1 series of automotive MCU chips.

   In 2000, he was admitted to Tsinghua University. Department of Electronic Engineering, Tsinghua University, Majoring in Electronic Science and Technology (Bachelor, 2000); Institute of Microelectronics, Tsinghua University, Major in Electronic Science and Technology (Master, 2004).

   He led and completed the development of several digital TV set-top box decoder chips and video/speech AI chips, and drove the company's IPO. Worked in MStar, Lanqi, AMD, Dome Technology (KDDI), as circuit engineer, senior IC design engineer, and SoC design director.

   He worked as circuit engineer, senior IC design engineer, senior SoC design engineer, and director SoC chip architect. Successfully completed >5 generations of digital TV set-top box decoding SoC chips, with market share >56.8%, the first batch of listed companies on the Science and Technology Board, Shanghai Stock Exchange (stock code 688008). during the tenure of AMD (global PC CPU, Top3), engaged in the development of general memory control module (graphics processor related). During the tenure of Dome Technology, successfully developed CSK6 series artificial intelligence chip neural network processor.

   As a co-founder of YiMoon , he was the chief chip architect and SoC design director, and led the development of J3 H1/L1 series of automotive MCU chips.

   Sean was the assistant president of Hi-image, vice president and senior technical director of Hi-image, and general manager of China Electronics GTA DS (CIDM Alliance platform). He has granted more than 40 invention patents. As a technology leader, he has led the development of >20 chips, including: TV picture quality chips, smart SoC chips, TCON chips, Bluetooth chips, voice chips, display chips, etc. Simultaneously undertake >10 national nuclear high base major special projects, industrial transformation and upgrading, electronic information industry technology transformation, independent innovation special projects and other major national and provincial R&D projects development and research.

 Sean has been a senior executive of Hisense chip company for >10 years, and successfully developed "Hisense III" chip, and completed the acquisition of Huaya Microelectronics (set-top box SoC main control chip, industry top 3) and Kiwi Technology (TCON display chip, global top 1), and completed the overseas integration of Toshiba TVS chip team in Japan. On January 12, 2023, Hi-image was officially spun off and listed on the domestic stock exchange (Hi-image).

As a co-founding team, he joined YiMoon Technology and is fully responsible for the company's chip platform and hardware and software system solutions, as well as the technical development, team management and organizational operations of the Shenzhen branch.

More than 22 years of experience in science and technology planning, strategic layout and company listing operation. Fully involved in Unigroup chip and education fund layout.

At the beginning of 2019, as the Chinese strategy Director completed the operation profit and company management of the Qixinghai Project (total investment: $2.97 billion) within 11 months.

   Graduated from Peking University, Certified Public Accountant (one-time pass), more than 20 years of investment and financing, financial management experience. He has worked in HSBC, Temasek and other internationally renowned financial institutions, as CFO and secretary of the board of directors of A-share listed companies, and as CFO of semiconductor companies to be listed. With commercial bank equity funds, listed companies, semiconductor industry integration of professional skills, strategic resources and strong industry acumen.

   Joined the co-founding team and served as CFO and vice president of Chengdu Company, taking full charge of the company's finance, investment and financing, as well as the operation organization and company management of Chengdu Company.